Experimental Evaluation of Thermal Transport Characteristics of MMC’s for heat Sink Material for Electronics Cooling
G.V Krishna Reddy1, N.Chikkanna2, H.S Monohar3, B.Umamaheswar Goud4
1Dr. G.V.Krishna Reddy, Department of Mechanical Engineering of Govt Polytechnic, Channasandra – Bangalore, Karnataka,India
2Dr. N.Chikkanna, Government Engineering College, Hoovina hadagali, Bellary, Karnataka, India
3Dr. B. Uma maheshwar Gowd. Director,of Adamissions, jwaharlal NehruTechnological University- Anantapur Andhra Pradesh, india.
4Dr. H.S Monohar. Associate Professor, SEA college of Engineering, Bangalore, K.A. India.
Manuscript received on March 05, 2014. | Revised Manuscript Received on March 09, 2014. | Manuscript published on March 18, 2014. | PP: 06-12 | Volume-1, Issue-3, March 2014. | Retrieval Number: D0145031414
Open Access | Ethics and Policies | Cite
© The Authors. Published By: Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In this work, effort has been made in the evaluation and enhancement of thermal transport characteristics of metal matrix composites. The Thermal management systems are important in today’s faster growing industrial needs which are demanding the high end processors with highest speed and reliability of performance. However, this work focuses on the development of new material for heat sink. Generally, the heat sink is attached to the CPU by the manufacturer mechanically. There is possibility of high stress inducement in the CPU due to mechanical fastening and the heat transfer is not effective as there will be a 100% surface to surface contact. Also there is a high possibility of shorting of electronic circuitry of the CPU due to the high conductivity of the heat sink material. In order to overcome these problems, effort is made to resolve the problem by developing the metal matrix composites to match with the required properties of the heat source. In this work, initially, the importance and motivation behind the evaluation of the thermal characteristics for the MMC’s. The development of new MMC’s was detailed along with the different compositions of the MMCs. For this, initially, baseline materials were explained in detail along their thermal properties. Six MMC’s have been proposed with varying compositions of aluminum and silicon carbide. Aluminum was varied in percentage composition from 25% to 65% and Sic was varied between 35% to 75%. The MMC’s were evaluated for the properties lie thermal conductivity, specific heat, thermal diffusivity, CTE. Also, the variation of these properties with respect to temperature is evaluated. Finally recommendations are given for the MMC’s based on the required property criteria of the heat source material.
Keywords: Aluminum, Silicon carbide, Heat sink, Thermal conductivity, CTE, Specific heat.